Special issue/Three-dimensional molded circuit boards. Molded interconnection devices.

Three-Dimensional Molded Interconnect Devices (3D-MID)

An Integrated Design System for Molded Interconnect Devices (3d-mid)

In this paper, MIDCAD, an integrated design system for Molded Interconnect Devices, is presented and some important techniques for the development of this design system are discussed. A series of MID-related special functions and an integrated MID product model, which are not supported by conventional MCAD und ECAD systems, were developed in MIDCAD. Based on the product model, the simulation of...

Three dimensional metal pattern transfer for replica molded microstructures

We report a replica molding process for simultaneously forming a three dimensional metal pattern on the surface of molded polymer microstructures. This technique uses noncovalent surface forces to guide the transfer of thin metal films from the three dimensional features of high aspect ratio poly dimethylsiloxane micromolds to polymeric replicates. The utility of this technique has been demonst...

Failure strengths of denture teeth fabricated on injection molded or compression molded denture base resins.

STATEMENT OF PROBLEM Denture tooth fracture or debonding remains a common problem in removable prosthodontics. PURPOSE The purpose of this in vitro study was to explore factors determining failure strengths for combinations of different denture tooth designs (shape, materials) and injection or compression molded denture base resins. MATERIAL AND METHODS Three central incisor denture tooth d...

Injection Molded Millimeter-Wave Horn Array Antenna

This paper shows injection molded millimeter-wave horn array antenna for the 1-dimensional APAA(Active Phase Array Antenna). The antenna is composed of horn antennas, grooved circular waveguide polarizers, E-plane T-junctions, and E-plane bends employing dielectric waveguides. This structure makes it possible to manufacture a feed circuit and radiating elements as an integrated unit by using in...